Scientist, Thermal Management and Characterization for Adv Pkg, IME

Job Description

About the Role A*STAR Institute of Microelectronics (IME) is seeking a highly motivated Scientist / Senior Scientistto conduct R&D in thermal management, heat dissipation, and advanced cooling technologies fornext-generation semiconductor packaging. The successful candidate will develop innovativethermal solutions for heterogeneous integration, AI/HPC packages, chiplets, 2.5D/3D integration,power electronics, and photonics applications. This role involves adopting advanced thermal/cooling concepts into package technologies through close collaboration with multidisciplinary teams in materials, packaging integration, reliability,simulation, and industry partners. He/she focuses on practical execution of thermal R&D activities,including simulation, testing, data analysis, prototype evaluation, and implementation of innovativethermal solutions for next-generation packages such as AI/HPC, chiplet, 2.5D/3D integration,photonics, and power electronics. Show More