R&D Engineer (Electroplating / Packaging Solutions)
DOCTECH HK LIMITED · Hong Kong
Apply nowJob Description
What You’ll Do • Support R&D on electroplating chemistries and metal surface treatments for advanced packaging. • Prepare and run experiments (bath make-up, plating trials, process parameter tuning, sample preparation). • Perform routine materials characterization and testing (e.g., thickness/uniformity, roughness, adhesion, basic electrochemical tests), and compile results clearly. • Record data, write experiment reports, and help maintain SOPs and lab documentation. • Assist scale-up activities: troubleshooting, stability checks, repeatability studies, and process transfer support.
DOCTECH HK LIMITED
Hong Kong
View other roles at DOCTECH HK LIMITED3 roles at DOCTECH HK LIMITED on ExpatJobBoard
Similar Jobs
Showing 5 matchesSenior R&D Engineer (Electroplating / Packaging Solutions) — Master Graduate
DOCTECH HK LIMITED · Hong Kong
Posted 2 days ago
Chief Operating Officer (COO)
DOCTECH HK LIMITED · Hong Kong
Posted 13 days ago
Software Engineer - Infrastructure & Reliability
Bonhill Partners · Hong Kong
Posted today
Director, Expert Services
Kroll · Hong Kong
Posted yesterday
Senior Cloud Operations Engineer
RedotPay · Hong Kong
Posted yesterday