R&D Engineer (Electroplating / Packaging Solutions)

DOCTECH HK LIMITED · Hong Kong

Job Description

What You’ll Do • Support R&D on electroplating chemistries and metal surface treatments for advanced packaging. • Prepare and run experiments (bath make-up, plating trials, process parameter tuning, sample preparation). • Perform routine materials characterization and testing (e.g., thickness/uniformity, roughness, adhesion, basic electrochemical tests), and compile results clearly. • Record data, write experiment reports, and help maintain SOPs and lab documentation. • Assist scale-up activities: troubleshooting, stability checks, repeatability studies, and process transfer support.

DOCTECH HK LIMITED

Hong Kong

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R&D Engineer (Electroplating / Packaging Solutions)

Job Description

DOCTECH HK LIMITED

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